(1)Guang Chen, Jiqiang Li, Xinwen Kuang, Yaofeng Wu#, Fengshun Wu. The study on reliability of Ni-coated graphene doped SAC305 lead-free composite solders under high current-density stressing, Soldering & Surface Mount Technology, 2019, 31(4): 261-270. 发表时间:2019-9-2.
(2)Guang Chen, Yaofeng Wu#. Main application limitations of lead-free composite solder doped with foreign reinforcements, Journal of Materials Science: Materials in Electronics. 2021,32(20):24644-24660. 发表时间:2021-9-10
(3)Guang Chen, Yaofeng Wu#. Microstructural and compositional evolution of SAC305/TiN composite solder under thermal stressing, Soldering & Surface Mount Technology. 2022, 34(3):183-190. 发表时间:2022-4-12